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Utilizing ultra-precision machining to demonstrate excellent bonding properties.
A wedge is a tool used in wedge bonding. Wedge bonding is a method of joining a wire to an electrode using ultrasonic vibrations and pressure transmitted from a transducer to the bonding tool. Typically, tungsten carbide (WC) is used for aluminum wire, while titanium carbide (TiC) is used for gold wire.
Supporting the growing IoT industry! Providing packaging and assembly solutions for products!
We introduce solutions specialized for the IoT industry offered by Micro Point Pro Co., Ltd. The "fine wire wedge bonding tool" guarantees high yield and stable bonding results. Continuous development of materials and design allows for the optimization of bonding performance.
We offer a tabletop manual wire bonder with over 9,000 units in operation worldwide, including wedge bonding tools. Our support system is also robust.
Micro Point Pro Co., Ltd. has 40 years of experience and expertise since its establishment, and offers a wide range of products for the semiconductor and microelectronics device assembly industry. Based in Israel, it is supported by 150 employees and 600 employees from group companies. MPP covers all manufacturing processes from raw materials to finished products and has numerous achievements with many global companies. 【Products Offered】 ■ Wedge bonding tools (fine wire and heavy wire wedge tools) ■ Die collet ■ Manual wire bonders ■ Pick & place and flip chip tools ■ Dispensers & solder jet ball tools ■ Surface mount dispensers & nozzles
